Hon. William C. Conner Writing Competition

Application Information

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Amount
Awarded

$1,250

Awarded

Application Deadline

February 28

Friday
Awarded By:

New York Intellectual Property Law Association (NYIPLA)

Number of Awards & Eligibility: Two awards will be provided annually.
In order to qualify, students must meet the following criteria:
  1. Must be currently enrolled in a law school in the United States.

In order to qualify, students must meet the following criteria:

Description: The Hon. William C. Conner Writing Competition is available for current law school students in the United States. Applicants must submit a legal paper on the topic of intellectual property.

Application requirements for the Hon. William C. Conner Writing Competition are:

  • Application form
  • Essay
Additional Information: The Hon. William C. Conner Writing Competition is provided annually by the New York Intellectual Property Law Association (NYIPLA) and awards multiple scholarships to current law school students who submit excellent papers on the topic of intellectual property. Papers will be judged based on professionalism, topic relevance, organization, quality of legal analysis, and overall strength of writing.

Award Amount: $1,500 for the first place applicant and $1,000 for the runner-up. Awards are provided on a one-time basis and are non-renewable.  The total dollars awarded for this scholarship is $1,250.

Deadline Information:

Deadline for this scholarship is Friday, February 28

Deadline Information:

Deadline for this scholarship is Friday, February 28

Application instructions for the Hon. William C. Conner Writing Competition are available online using the provided links. To be considered for this scholarship, students must submit an original legal paper of up to 20 pages in length that addresses one or more of the traditional subject areas of intellectual property law, such as patents, trademarks, copyrights, trade secrets, unfair trade practices, and antitrust law. All written submissions must be received no later than the deadline date.
Contact: Richard H. Brown
Address: Day Pitney LLP 7 Times Square New York, New York 10036-7311

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